Solderless, pushdown connectors for RF and DC
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United States of America Patent
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-
Mar 28, 1989
Issued Date -
N/A
app pub date -
Feb 25, 1988
filing date -
May 19, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A connector arrangment (13) for electrically connecting first and second microstrip structures (15,15') carrying for example RF and DC voltage values therebetween, the groundplates of the connector arrangement (13) and said microstrip structures (15,15') establishing an offset stripline arrangement, the dielectric layer of the connector arrangement (13) being substantially thicker and the dielectric constant thereof substantially lower in value than the corresponding values of the dielectric layers of said microstrip structures (15,15'), thereby enabling the metalization lines (18, 20 and 21) in the connector arrangement (13) to be relatively wide to enable effective alignment of microstrip structures (15,15') and connector arrangement (13).
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