Wire bonding surface
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United States of America Patent
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-
Sep 30, 2003
Grant Date -
Feb 27, 2003
app pub date -
Aug 24, 2001
filing date -
Aug 24, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A bonding pad for connecting an electrical energy storage device to an implantable medical device, is described. The bonding pad comprises at least two contact surfaces, one have a channel for receiving the terminal lead of the electrical energy storage device, the other being relatively planar for contact to the medical device. That way, the channel provides for increased surface area contact with the terminal lead for a more robust connection while the opposite, planar contact surface provides flexibility for contact to a lead of the medical device.
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