Multilayer chip capacitor

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7262952
APP PUB NO 20060285271A1
SERIAL NO

11453880

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention provides a multilayer chip capacitor reduced in ESL. A capacitor body has a plurality of dielectric layers stacked in a thickness direction. A plurality of first and second internal electrodes are separated from one another by the dielectric layers within the capacitor body. Each of the first internal electrodes opposes each of the second internal electrodes. Each of the first and second internal electrodes includes at least two leads extending toward any side of the capacitor body. Also, a plurality of external electrodes are formed on an outer surface of the capacitor body and connected to the internal electrodes via the leads. Further, vertically adjacent ones of the leads having the same polarity extend in different directions at a predetermined angle. The leads of the first and second internal electrodes are disposed adjacent to and alternate with those of the second internal electrodes.

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Patent Owner(s)

  • SAMSUNG ELECTRO-MECHANICS CO., LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chung, Hae Suk Seoul, KR 54 580
Lee, Byoung Hwa Kyungki-do, KR 173 1885
Park, Dong Seok Seoul, KR 58 923
Park, Min Cheol Kyungki-do, KR 177 1816
Park, Sang Soo Kyungki-do, KR 263 2439
Shim, Chang Hoon Kyungki-do, KR 10 245

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