Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11370857
APP PUB NO 20210206892A1
SERIAL NO

17271745

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A resin composition of the present invention contains: a maleimide compound (A) having a maleimide functional group equivalent of 300 g/eq. or more, and a transmittance of 1% or more at a wavelength of 405 nm (h-line); a maleimide compound (B) having a maleimide functional group equivalent of less than 300 g/eq.; and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).

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Patent Owner(s)

  • MITSUBISHI GAS CHEMICAL COMPANY INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kumazawa, Yune Tokyo, JP 8 0
Shika, Seiji Tokyo, JP 11 28
Suzuki, Takuya Tokyo, JP 135 855

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