Shielded multilayer printed wiring board, high frequency, high isolation
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United States of America Patent
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-
Oct 14, 1997
Grant Date -
N/A
app pub date -
Oct 18, 1991
filing date -
Oct 18, 1991
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A shielded printed wiring board is disclosed which provides electrical and magnetic isolation for the signal layers located thereon. The printed wiring board includes a signal layer laminated between two non-conductive dielectric layers. The bottom side of the printed wiring board has a conductive layer coated thereon. Grooves are routed through the printed circuit board on both sides of each signal layer extending from the top layer partially through to the conductive layer. Conductive metallic coatings are then provided to coat the board and thereby encapsulate the signal layer in a ground envelope, separated by a controlled thickness dielectric. In an alternate embodiment, a plurality of layers are laminated one on top of the other to provide a multilayer printed wiring board.
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