Ball grid array package stacking system
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United States of America Patent
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Jan 18, 2011
Issued Date -
N/A
app pub date -
Sep 8, 2008
filing date -
Sep 8, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
A ball grid array package stacking system includes: forming a heat spreader having a centrally located access port; mounting a substrate in the heat spreader for providing a connection pad in the centrally located access port; coupling an integrated circuit die to the substrate; and coupling a system interconnect to the integrated circuit die, the connection pad, or a combination thereof.
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