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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

• TELEFUNKEN SYSTEMTECHNIK GMBH

International Classification(s)

• B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Rusch, Dieter	Wedel, DE	2	20
Schmidt, Eckehard	Wedel, DE	10	88
Tauber, Manfred	Holm, DE	2	11

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent No: 4358331

Method of embedding semiconductor components in plastics

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