Epoxy resin composition

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4652597
SERIAL NO

06785402

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Abstract

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An epoxy resin composition which comprises: (a) an epoxy resin having an epoxy equivalent of at most 200; (b) a condensation mixture of 1 mol of a polybasic carboxylic acid anhydride, from 0.07 to 0.3 mol of a bisphenol A having the formula: ##STR1## and from 0.07 to 0.3 mol of a monohydric phenol having the formula: ##STR2## wherein R is an alkyl group, as a curing agent; and (c) an inorganic powder, as a filler.

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Patent Owner(s)

  • MITSUBISHI DENKI KABUSHIKI KAISHA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ando, Toshiharu Itami, JP 10 43
Itabashi, Yoshifumi Takarazuka, JP 10 90
Tsuchihashi, Masaru Sanda, JP 10 80
Yasuda, Kazuo Kawanishi, JP 32 445

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