Power semiconductor device and manufacturing method thereof
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United States of America
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Apr 23, 2024
Grant Date -
N/A
app pub date -
Oct 30, 2023
filing date -
Oct 30, 2023
priority date (Note) -
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Abstract
The present disclosure provides a power semiconductor device and a manufacturing method thereof. In order to provide a power semiconductor device with improved latch-up immunity but without increasing device power loss and costs, a hole current path in a fourth semiconductor region of a first conductivity type between a gate trench and a dummy gate trench is shortened by providing a first contact trench between two adjacent gate trenches, and providing a second contact trench between the gate trench and a dummy gate trench such that the width and depth of the second contact trench are respectively greater than those of the first contact trench. The effect of the hole current on the potential rise of the fourth semiconductor region of the first conductivity type is suppressed, thereby suppressing the latch-up effect, and enhancing the switching reliability.
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