Sputtering apparatus

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United States of America Patent

PATENT NO 9627187
SERIAL NO

14484634

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Abstract

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A sputtering apparatus includes a deposition preventing plate arranged between a substrate stage and a plurality of cathode electrodes, and a shutter plate arranged between the deposition preventing plate and the substrate stage. The deposition preventing plate has holes at positions respectively facing a plurality of targets held by the plurality of cathode electrodes. Concentric concavo-convex shapes centered on the rotation axis of the shutter plate are formed on surfaces, that face each other, of the deposition preventing plate and the shutter plate.

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Patent Owner(s)

  • CANON ANELVA CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishihara, Shigenori Yokohama, JP 19 408

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