Package structure of semiconductor and wafer-level formation thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 3, 2007
Issued Date -
N/A
app pub date -
Dec 7, 2005
filing date -
Mar 25, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In wafer-level formation of a package structure of semiconductor, multitudes of conductive connection structures are formed protruded from a transparent substrate. Multitudes of grooves are formed in a semiconductor wafer and an adhesive is filled therein. The wafer and the transparent substrate are jointed in which each of the conductive connection structures are positioned in one of the grooves and exposed outside of another surface of the semiconductor wafer. A package structure is obtained by sawing the wafer and has electrical connection between the signals of the active side and back side through the conductive connection structures.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully