Semiconductor package and method of manufacturing semiconductor package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11569200
APP PUB NO 20210249382A1
SERIAL NO

17015346

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Abstract

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A semiconductor package includes a package substrate, a processor chip mounted on the package substrate, a first stack structure on the package substrate, the first stack structure including a number M of memory chips stacked on the processor chip, and a second stack structure on the package substrate and spaced apart from the processor chip, the second stack structure including a number N of memory chips stacked on the package substrate. A number Q of channels that electrically connect the memory chips of the second stack structure with the processor chip may be greater than a number P of channels that electrically connect the memory chips of the first stack structure with the processor chip, or the number N of memory chips included in the second stack structure may be greater than the number M of memory chips included in the first stack structure.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jeong, Kihong Jeonju-si, KR 5 5
Song, Sangsub Suwon-si, KR 8 6

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