Semiconductor device and manufacturing method for semiconductor device

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United States of America Patent

PATENT NO 11830843
SERIAL NO

17295801

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Abstract

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A semiconductor device includes an insulating layer, conductors, a semiconductor element and a sealing resin. The insulating layer has first and second surfaces opposite to each other in the thickness direction. Each conductor has an embedded part whose portion is embedded in the insulating layer and a redistribution part disposed at the second surface and connected to the embedded part. The semiconductor element has electrodes provided near the first surface and connected the embedded parts of the conductors. The semiconductor element is in contact with the first surface. The sealing resin partially covers the semiconductor element and is in contact with the first surface. The redistribution parts include portions outside the semiconductor element as viewed in the thickness direction. The insulating layer has grooves recessed from the second surface in the thickness direction. The redistribution parts are in contact with the grooves.

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Patent Owner(s)

Patent OwnerAddress
ROHM CO LTDKYOTO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fuji, Kazunori Kyoto, JP 22 13

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