Systems and methods for evaluating the reliability of semiconductor die packages
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United States of America Patent
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May 23, 2023
Grant Date -
Aug 18, 2022
app pub date -
Mar 25, 2021
filing date -
Feb 15, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
A system and method for evaluating the reliability of semiconductor die packages are configured to sort a plurality of semiconductor dies with a Known Good Die (KGD) subsystem based on a comparison of an inline part average testing (I-PAT) score of each of the plurality of semiconductor dies to a plurality of I-PAT score thresholds, where the semiconductor die data includes the I-PAT score for each of the plurality of semiconductor dies, where the I-PAT score represents a weighted defectivity of the corresponding semiconductor die. The semiconductor dies may be filtered to remove at-risk semiconductor dies prior to sorting. The semiconductor die data may be received from a plurality of semiconductor die supplier subsystems. The KGD subsystem may transmit semiconductor die reliability data about the sorted plurality of semiconductor dies to a plurality of semiconductor die packager subsystems.
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