Method of manufacturing an electronic device
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United States of America Patent
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Dec 26, 2023
Grant Date -
N/A
app pub date -
May 25, 2022
filing date -
May 25, 2022
priority date (Note) -
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Abstract
A method of manufacturing an electronic device including the following steps is provided herein. A plurality of first electronic components is provided. The plurality of first electronic components is transferred onto a plurality of pickup sites. An empty pickup site from the plurality of pickup sites may be figured out, wherein the plurality of first electronic components is absent at the empty pickup site. A second electronic component is transferred onto the empty pickup site. A target substrate is provided. The plurality of first electronic components and the second electronic component are transferred onto the target substrate.
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