Thickness measuring apparatus and method using a microwave cavity resonator
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United States of America Patent
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Feb 6, 2007
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app pub date -
Jan 27, 2006
filing date -
Jan 27, 2006
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Abstract
A measurement device for measuring a thickness of a film layer over a substrate utilizes a microwave source and a resonant cavity having an open side. A microwave signal is introduced at a first end of the resonant cavity with the open side against a surface measurement sample having a film layer over a substrate, and an output signal detector senses the output power of the signal at a far end of the resonant cavity. A processor uses a difference in the resulting resonant frequency of the cavity from that using a substrate without the film layer to determine the thickness of the film layer.
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