Liquid-ejection head and method for manufacturing liquid-ejection head substrate
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United States of America Patent
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Feb 5, 2013
Grant Date -
Mar 12, 2009
app pub date -
Sep 5, 2008
filing date -
Sep 6, 2007
priority date (Note) -
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Abstract
A method for manufacturing a liquid-ejection head substrate including a silicon substrate having a supply port for supplying liquid is provided. The method includes: forming an etching mask layer on a surface of the silicon substrate, the etching mask layer having an opening in a portion corresponding to the supply port; forming a first recess in the surface of the silicon substrate by anisotropically etching the silicon substrate through the opening in the etching mask layer; forming a second recess that extends toward the other surface of the silicon substrate, in a surface of the first recess in the silicon substrate; and forming the supply port by anisotropically etching the silicon substrate from the surface provided with the second recess.
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