Substrate processing method and substrate processing apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6605550
APP PUB NO 20020139302A1
SERIAL NO

10154927

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In a hot plate for performing heat processing while an inert gas is supplied, a mounting table is provided with a groove and a lower end portion of a lid body can be inserted into the groove. The lid body is lowered in two steps by a lid body drive apparatus. The lid body forms a processing chamber between the lid body and the mounting table by the lowering of the first step, and the lower end portion of the lid body is inserted into the groove by the lowering of the second step, thereby reducing the processing chamber in capacity. Consequently, in a substrate processing apparatus which requires a supply of gas, it becomes possible to reduce the capacity of the processing chamber and to reduce the required amount of gas.

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Patent Owner(s)

  • TOKYO ELECTRON LIMITED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nagashima, Shinji Kikuyo-Machi, JP 28 1058

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