Vertical interconnect structures in three-dimensional integrated circuits

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United States of America

PATENT NO 11978723
APP PUB NO 20220328455A1
SERIAL NO

17538029

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Abstract

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A 3D IC structure includes multiple die layers, such as a top die layer and a bottom die layer. The top die layer and/or the bottom die layer each includes devices such as computing units, Analog-to-Digital converters, analog circuits, RF circuits, logic circuits, sensors, Input/Output devices, and/or memory devices. The devices on the first and the second die layers are laterally surrounded by, or adjacent, vertical interconnect structures (VIS).

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujiwara, Hidehiro Hsinchu, TW 147 461
Noguchi, Hiroki Hsinchu, TW 138 1263
Wang, Yih Hsinchu, TW 238 706
Yang, Tzu-Hsien Hsinchu, TW 11 11

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