Method of forming a semiconductor package and structure therefor
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United States of America Patent
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May 3, 2011
Grant Date -
Oct 8, 2009
app pub date -
Apr 7, 2008
filing date -
Apr 7, 2008
priority date (Note) -
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Abstract
In one embodiment, a semiconductor package is formed to include a leadframe that includes a plurality of die attach areas for attaching a semiconductor die to the leadframe. The leadframe is positioned to overlie another leadframe that forms some of the external terminals or leads of the package.
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