Semiconductor device structure with magnetic element in testing region

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11018065
APP PUB NO 20210057293A1
SERIAL NO

16548183

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Abstract

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A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate having a testing region and multiple first conductive lines over the testing region. The first conductive lines are electrically connected in series. The semiconductor device structure also includes multiple second conductive lines over the testing region. The second conductive lines are electrically connected in series, and the second conductive lines are physically separated from the first conductive lines. The semiconductor device structure further includes multiple magnetic structures wrapping around portions of the first conductive lines and wrapping around portions of the second conductive lines. The magnetic structures are arranged in a column.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiu, Tang-Jung Hsinchu, TW 9 1159
Lai, Chi-Chang Taichung, TW 24 47
Liao, Weii New Taipei, TW 3 0
Lii, Mirng-Ji Sinpu Township, Hsinchu County, TW 241 5652
Tsai, Chia-Heng New Taipei, TW 3 0
Wang, Mill-Jer Hsinchu, TW 81 550

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