Heat dissipation for electronic components on a ceramic substrate
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United States of America Patent
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Jul 21, 1987
Issued Date -
N/A
app pub date -
Sep 9, 1986
filing date -
Oct 11, 1984
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A heat dissipator for electronic components comprising a ceramic plate having a first surface for receiving heat from the electronic components and a second surface, and a plurality of separate, spaced metallic, heat-conducting elements mounted on and extending from the second surface of the ceramic plate.
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