Semiconductor chip with a metal heat radiator
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United States of America Patent
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-
Feb 18, 1986
Grant Date -
N/A
app pub date -
Mar 30, 1983
filing date -
Mar 31, 1982
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor chip, including a semiconductor substrate and a radiator plate. An active region is formed on one main surface of the semiconductor substrate. The radiator plate is bonded to the other main surface side of the semiconductor substrate. A recess is formed on the other main surface side so as to dispose the radiator plate therein.
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