Electronic device and method for manufacturing the same
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United States of America Patent
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Mar 19, 2019
Grant Date -
Nov 8, 2018
app pub date -
Mar 13, 2017
filing date -
Apr 4, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
In an electronic device, an inner lead of a signal terminal includes a base member, and a film on a surface of the inner lead adjacent to a bonding surface. The film includes a metal thin film disposed on the surface of the base member and having a portion to which a bonding wire is connected, and an oxide film made of an oxide of the same metal as a metal being a main component of the metal thin film, and disposed in at least a part of a region of the metal thin film, excluding a connection region of a bonding wire. The oxide film includes an uneven oxide film having a surface with continuous asperities formed by irradiating the metal thin film with pulsed laser light. The uneven oxide film is disposed in at least a part of a front end region of the bonding surface.
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