Polishing method and apparatus
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United States of America Patent
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-
Jul 25, 2006
Grant Date -
Jun 16, 2005
app pub date -
Dec 6, 2004
filing date -
Dec 15, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Provided is a polishing method of polishing a substrate by rotating the substrate and a pad while keeping the pad in contact with the substrate, the method including: a first polishing step of polishing the substrate by rotating the substrate and the pad in a first direction; and a second polishing step of polishing the substrate by rotating the substrate and the pad in a second direction opposite to the first direction.
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