Semiconductor packages with interconnection features in a seal region and methods for forming the same

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United States of America Patent

PATENT NO 11854987
APP PUB NO 20220293527A1
SERIAL NO

17383338

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Abstract

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Embodiments of the present disclosure provide an integrated circuit die with vertical interconnect features to enable direct connection between vertically stacked integrated circuit dies. The vertical interconnect features may be formed in a sealing ring, which allows higher routing density than interposers or redistribution layer. The direct connection between vertically stacked integrated circuit dies reduces interposer layers, redistribution process, and bumping processes in multi-die integration, thus, reducing cost of manufacturing.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Ming-Han Taipei, TW 147 332
Shue, Shau-Lin Hsinchu, TW 407 6064
Yang, Shin-Yi New Taipei, TW 108 217

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