Water jet cutting device with improved part-holding device
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United States of America Patent
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Sep 10, 2013
Grant Date -
Jan 13, 2011
app pub date -
Dec 17, 2008
filing date -
Dec 20, 2007
priority date (Note) -
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Abstract
High-pressure water jet cutting techniques generate numerous handling problems both for the plates being cut and for cut parts. These problems can be resolved by the device according to the disclosed embodiments. This device includes a plurality of wires held under stress at a predetermined stress level above a plate being cut. These wires intercept a jet cutting the plate. This interception results in the creation of a micro-fastener holding the cut part to the plate. This micro-fastener can be easily broken. The plurality of wires also prevents the boiling effect of water in a cutting pool, this boiling resulting from the impact of the water jet in the pool.
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