Chip embedded package structure
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United States of America Patent
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-
Jan 30, 2007
Issued Date -
N/A
app pub date -
Nov 18, 2004
filing date -
May 11, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A chip embedded package structure is provided. A stiffener is disposed on a tape. The tape has at least an alignment mark and the stiffener has at least a chip opening. A chip having a plurality of bonding pads thereon is disposed on the tape within the chip opening such that the bonding pads face the tape. A plurality of through holes is formed in the tape to expose the bonding pads respectively. After that, an electrically conductive material is deposited to fill the through holes and form a plurality of conductive vias that connects with the bonding pads respectively. A multi-layered interconnection structure is formed on the surface of the tape away from the chip. The multi-layered interconnection structure has an inner circuit that connects to the conductive vias. The inner circuit has a plurality of metallic pads disposed on the outer surface of the multi-layered interconnection structure.
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