Multiple path configuration for power supply power of semiconductor chip modules
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United States of America Patent
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Feb 13, 2018
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N/A
app pub date -
Jun 23, 2016
filing date -
Sep 18, 2015
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Abstract
A semiconductor chip includes a first circuit block configured to receive a first power supply voltage through a first power supply terminal of the semiconductor chip, a second circuit block configured to receive a second power supply voltage through a second power supply terminal of the semiconductor chip, and an alternative supply unit that is connected between the first power supply terminal and the first circuit block and receives the first power supply voltage through the first power supply terminal. The alternative supply circuit is configured to apply an alternative power supply voltage generated using the second power supply voltage to the first circuit block in response to a supply of the first power supply voltage being stopped.
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