Lead frame and semiconductor device having the same as well as method of resin-molding the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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May 17, 2005
Grant Date -
Jan 30, 2003
app pub date -
Jul 30, 2002
filing date -
Jul 30, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A lead frame structure includes: at least a die pad for mounting a semiconductor chip thereon; a plurality of suspension members mechanically connected with the die pad; and a plurality of supporting members. Each supporting member has a connection region mechanically connected with each of the plurality of suspension members for mechanically supporting the at least die pad via the plurality of suspension pins. The connection region of the supporting member has a penetrating opening portion which provides a mechanical flexibility to the connection region and which allows the connection region to be deformed toward the suspension member upon application of a tensile stress to the suspension member in a down-set process.
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