Printed wiring board and method for producing the same
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United States of America Patent
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May 19, 2009
Grant Date -
N/A
app pub date -
Sep 28, 1999
filing date -
Sep 28, 1998
priority date (Note) -
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Abstract
The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in fracture toughness, dielectric constant, adhesion and processability, among other characteristics.The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
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