Three-dimensional integrated circuit having stabilization structure for power supply voltage, and method for manufacturing same
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United States of America Patent
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Aug 4, 2015
Grant Date -
Jun 5, 2014
app pub date -
Apr 10, 2013
filing date -
May 10, 2012
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Abstract
The three-dimensional integrated circuit has a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip, wherein each of the first semiconductor chip and the second semiconductor chip is provided with a power supply wiring layer which has a wiring pattern structure for stably supplying a power supply voltage to an internal circuit of the semiconductor chip, and a ground wiring layer in succession, and one of the first semiconductor chip and the second semiconductor chip further includes a second ground wiring layer or a second power supply wiring layer on a surface facing to the other semiconductor chip.
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