Printed circuit board and method of fabricating an element

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9991196
APP PUB NO 20170271253A1
SERIAL NO

15435398

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides a printed circuit board fabricated by a Non-Plating Process that includes at least one plating bar disposed around at least one package unit of the printed circuit board. The package unit includes at least one ground line, at least one power line and a plurality of signal lines. The ground line has a first contact pad exposed on a surface of the printed circuit board, and at least one of the ground lines is connected to the plating bar. The power line has a second contact pad exposed on the surface, and at least one of the power lines is connected to the neighboring plating bar. The signal line has a third contact pad exposed on the surface.

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First Claim

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Patent Owner(s)

  • SILICON MOTION, INC. (TW)

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Hsiu-Yuan Zhubei, TW 4 0
Chen, Te-Wei Zhubei, TW 29 50
Huang, Shu-Ying Hsinchu, TW 16 32

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