Semiconductor light emitting device, method for manufacturing same, and method for forming underlying layer

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8058660
APP PUB NO 20090072253A1
SERIAL NO

12208776

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed herein is a semiconductor light emitting device including: (A) an underlying layer configured to be formed on a major surface of a substrate having a {100} plane as the major surface; (B) a light emitting part; and (C) a current block layer, wherein the underlying layer is composed of a III-V compound semiconductor and is formed on the major surface of the substrate by epitaxial growth, the underlying layer extends in parallel to a <110> direction of the substrate, a sectional shape of the underlying layer obtained when the underlying layer is cut along a virtual plane perpendicular to the <110> direction of the substrate is a trapezoid, and oblique surfaces of the underlying layer corresponding to two oblique sides of the trapezoid are {111}B planes, and the top surface of the underlying layer corresponding to an upper side of the trapezoid is a {100} plane.

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Patent Owner(s)

  • SONY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kamada, Michiru Miyagi, JP 10 16
Karino, Sachio Miyagi, JP 11 45
Nagatake, Tsuyoshi Kanagawa, JP 9 33
Narui, Hironobu Kanagawa, JP 68 776
Okano, Nobukata Kanagawa, JP 24 387
Oogane, Makoto Kanagawa, JP 8 57
Takase, Eiji Miyagi, JP 6 16

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