Integrated circuit package system with package substrate having corner contacts and method of manufacture thereof
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United States of America Patent
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Jan 4, 2011
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N/A
app pub date -
Nov 4, 2009
filing date -
Nov 16, 2007
priority date (Note) -
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Abstract
A method of manufacture of an integrated circuit package system includes: forming a package substrate with a top substrate side and a bottom substrate side; forming a corner contact in a first corner of the bottom substrate side, the corner contact extending to a substrate edge of the package substrate; mounting an integrated circuit device over the top substrate side; connecting an electrical interconnect between the integrated circuit device and the top substrate side; and forming a package encapsulation over the top substrate side, the integrated circuit device, and the electrical interconnect.
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