Reducing mechanical resonance and improved distribution of fluids in small volume processing of semiconductor materials
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 12, 2010
Grant Date -
N/A
app pub date -
Aug 16, 2005
filing date -
Jun 30, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus for processing a substrate is provided. The apparatus includes a plating head configured to plate a surface of the substrate with a layer of a material using a fluid meniscus between the plating head and a surface of the substrate. The apparatus also includes a fluid meniscus stabilizing apparatus configured to apply a pre-processing fluid to the surface of the substrate before the fluid meniscus is applied to the surface.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully