Structure of printed circuit board with stacked daughter board
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United States of America Patent
Stats
-
Jun 18, 2002
Grant Date -
N/A
app pub date -
Jul 9, 1999
filing date -
Jun 23, 1999
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A structure of a printed circuit board with stacked daughter board. The structure has a motherboard and at least a daughter board. The motherboard has a first signal layer, a second signal layer, a first power layer, a first ground layer and isolation layers between every layer. The first signal layer and the second signal layer serve as surfaces of the motherboard and first contacts are formed on the first signal layer. The daughter board includes a third signal layer, a fourth signal layer, a second power layer, a second ground layer and isolation layers between every layer. The second power layer or the second ground layer serves as a surface of the daughter board and second contacts are formed on the surface. The daughter board is stacked on the motherboard and the second contacts are coupled with the first contacts.
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