Power module having self-contained cooling system
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United States of America Patent
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Nov 11, 2008
Grant Date -
May 1, 2008
app pub date -
Oct 25, 2006
filing date -
Oct 25, 2006
priority date (Note) -
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Abstract
A semiconductor module comprises a housing having a cavity therein, and at least one semiconductor device residing within the cavity. A cooling system is contained within the housing and comprises a dielectric fluid disposed within the housing and a flow passageway disposed through the housing. The flow passageway is fluidly coupled to the cavity, and the cooling system is configured to circulate the dielectric fluid through the flow passageway and onto the at least one semiconductor device.
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