Method of breaking down a fuse in a semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7180810
APP PUB NO 20050099860A1
SERIAL NO

11015030

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor device has: a fuse having one end applied with a first voltage, and a MOS transistor having source, gate and drain and a connection point between the other end of the fuse and one of the source and drain, a second voltage lower than the first voltage applied to the other of the source and drain, wherein: the first and second voltages, characteristics of the MOS transistor and a resistance of the fuse are selected so that the fuse can be broken down when a predetermined program voltage is applied to the gate; and the resistance of the fuse is set to such a value as a voltage difference between a voltage at the connection point and the second voltage is lower than a drain voltage of the MOS transistor at which a drain current starts saturating, when the program voltage is applied to the gate.

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Patent Owner(s)

  • YAMAHA CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kamiya, Takayuki Hamamatsu, JP 29 361
Omura, Masayoshi Hamamatsu, JP 53 1083

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