Compliant organic substrate assembly for rigid probes

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United States of America Patent

PATENT NO 11561243
APP PUB NO 20210080486A1
SERIAL NO

16568596

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Abstract

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A wafer test device and methods of assembling a wafer test device involve a first laminate structure, and a second laminate structure arranged to interface with a microcircuit of the wafer. The wafer test device includes a compliant layer between the first laminate structure and the second laminate structure. The compliant layer includes an elastomer that exhibits compliance within a limited range of movement.

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Patent Owner(s)

  • IBM CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Audette, David Colchester, US 5 70
Conti, Dennis Essex Junction, US 4 170
Knox, Marc Hinesburg, US 2 8
Wagner, Grant Jericho, US 22 155

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