Low dielectric constant siliceous film manufacturing composition and methods for producing cured film and electronic device using the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11512171
APP PUB NO 20220267532A1
SERIAL NO

17633234

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

To provide a low dielectric constant siliceous film manufacturing composition capable of forming a low dielectric constant siliceous film with dispersed pores having excellent mechanical properties and stable electrical properties. [Means] The present invention provides a low dielectric constant siliceous film manufacturing composition comprising: a polysiloxane, a pore-generating material, a condensation catalyst generator, and a solvent.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • MERCK PATENT GMBH

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aida, Kensuke Kakegawa, JP 2 0
Arima, Kazuya Kakegawa, JP 17 38
Sakurai, Issei Kakegawa, JP 3 13

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 May 29, 2026
7.5 Year Payment $3600.00 $1800.00 $900.00 May 29, 2030
11.5 Year Payment $7400.00 $3700.00 $1850.00 May 29, 2034
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00