Dual-cure method and system for fabrication of 3D polymeric structures cross-reference to earlier applications

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United States of America Patent

PATENT NO 11629227
APP PUB NO 20220380541A1
SERIAL NO

17875441

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Abstract

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A dual-cure method for forming a solid polymeric structure is provided. An end-capped, imide-terminated prepolymer is combined with at least one photopolymerisable olefinic monomer, at least one photoinitiator, and a diamine, to form a curable resin composition, which, in a first step, is irradiated under conditions effective to polymerize the at least one olefinic monomer, thus forming a scaffold composed of the prepolymer and the polyolefin with the diamine trapped therein. The irradiated composition is then thermally treated at a temperature effective to cause a transimidization reaction to occur between the prepolymer and the diamine, thereby releasing the end caps of the prepolymer and providing the solid polymeric structure. A curable resin composition comprising an end-capped, imide-terminated prepolymer, at least one photopolymerisable olefinic monomer, at least one photoinitiator, and a diamine, is also provided, as are related methods of use.

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Patent Owner(s)

  • ZHEJIANG XUNSHI TECHNOLOGY CO., LTD

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Borjigin, Hailun Zhejiang, CN 5 2
Zhang, Lingzhu Beijing, CN 5 2

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