Chip packaging
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 6, 2001
Grant Date -
N/A
app pub date -
May 13, 1999
filing date -
May 13, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
The invention provides a chip package, particularly a dual-chip package, that is featured by directly connecting a lead frame to at least a chip included therein, and is specifically featured by directly connecting the inner leads of a lead frame to the bumps formed on at least two chips included therein.
Loading the Abstract Image...
OK
First Claim
Family
Loading Family data...
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully