Method, apparatus and computer program product for implementing thermal integrity screening
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United States of America Patent
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Feb 27, 2007
Grant Date -
N/A
app pub date -
Nov 3, 2005
filing date -
Nov 3, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method, apparatus and computer program product are provided for implementing thermal integrity screening. Predefined processor module temperature data are obtained and processed. An initial thermal calibration is performed to record a predefined processor resistance with no power applied to the processor module. A limit check is performed at power up to detect and compare a thermal bond operating temperature with an identified threshold temperature for the processor module. Responsive to an identified thermal bond operating temperature greater than the identified threshold temperature, the processor module is shutdown and the processor module failed.
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