Modular die sockets with flexible interconnects for packaging bare semiconductor die
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jul 18, 2000
Grant Date -
N/A
app pub date -
May 4, 1998
filing date -
May 4, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A modular bare die socket assembly 10 for attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined vertically in a horizontal stack, wherein each plate 14 has a die socket 22 for the removable insertion of a bare semiconductor die 18. A multi-layer interconnect lead tape 50 has a plurality of lithographically formed leads bent on one end to form nodes 88 for attachment to bond pads 90 on the removably inserted semiconductor die 18, and having opposing ends 92 connectable to the substrate.
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