Selective atomic layer depositions

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United States of America Patent

PATENT NO 8815344
APP PUB NO 20130243956A1
SERIAL NO

13420146

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Abstract

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Method for selectively depositing an atomic layer deposition film on a substrate having two different surfaces are generally described. More specifically, methods for depositing TaN selectively onto one or more of a dielectric or metal versus the other of a dielectric of metal.

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Patent Owner(s)

  • APPLIED MATERIALS, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ma, Paul F Santa Clara, US 66 2287

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