Integrated circuit package including inward bent leads

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10840171
APP PUB NO 20200168531A1
SERIAL NO

16202808

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A packaged semiconductor device includes a semiconductor die mounted on a leadframe, a housing for the semiconductor die defining a horizontal plane and a horizontal direction. The leadframe includes leads each having an inner lead portion inside the housing and an outer lead portion that includes a first portion that extends out in the horizontal direction from one of the sidewalls of the housing, a transition portion that includes a vertical direction component, and a distal end portion, wherein the distal end portion of the leads are all on the horizontal plane. The outer lead portions alternate between a gull wing lead shape having the distal end portions extending in the horizontal direction outward from the housing and inward extending leads that have their distal end portions extending in the horizontal direction inward toward the housing. The leadframe consists of a single leadframe.

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Patent Owner(s)

  • AGILENT TECHNOLOGIES TEXAS INSTRUMENTS INCORPORATED

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eisenhart, Scott F Allen, US 1 1
Koduri, Sreenivasan K Allen, US 121 524
Meyers, Michael L Dallas, US 3 2
Saye, Richard J Greenville, US 6 47

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