Integrated circuit package and method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11855067
APP PUB NO 20220392884A1
SERIAL NO

17884096

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A device package includes a first die directly bonded to a second die at an interface, wherein the interface comprises a conductor-to-conductor bond. The device package further includes an encapsulant surrounding the first die and the second die and a plurality of through vias extending through the encapsulant. The plurality of through vias are disposed adjacent the first die and the second die. The device package further includes a plurality of thermal vias extending through the encapsulant and a redistribution structure electrically connected to the first die, the second die, and the plurality of through vias. The plurality of thermal vias is disposed on a surface of the second die and adjacent the first die.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiou, Wen-Chih Zhunan Township, TW 401 8694
Lin, Yung-Chi Su-Lin, TW 89 1557
Yu, Chen-Hua Hsinchu, TW 2081 43987

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