Polishing solution and polishing method

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United States of America Patent

PATENT NO 11655394
APP PUB NO 20200369917A1
SERIAL NO

16636816

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Abstract

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Polishing liquid comprising abrasive grains, a phosphonic acid compound having a molecular weight of 210 or more, and at least one selected from the group consisting of amino acids and amino acid derivatives, in which a silanol group density of the abrasive grains is 6.5 groups/nm2 or less, and a degree of association of the abrasive grains is 1.5 or more.

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Patent Owner(s)

  • RESONAC CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iwano, Tomohiro Tokyo, JP 51 279
Otsuka, Yuya Tokyo, JP 10 10

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