Semiconductor device assemblies including multiple stacks of different semiconductor dies

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11961821
APP PUB NO 20220375897A1
SERIAL NO

17881998

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Abstract

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A semiconductor device assembly is provided. The assembly comprises a package substrate, a first stack of semiconductor dies having a first set of planform dimensions disposed over a first location on the substrate, a second stack of semiconductor dies having a second set of planform dimensions different from the first set disposed over a second location on the substrate, and an encapsulant at least partially encapsulating the substrate, the first stack and the second stack. The first stack of semiconductor dies has a first planform area, the second stack of semiconductor dies has a second planform area, and a sum of the first and second planform areas can be at least 50%, 67%, 75% or even more of an area of the package substrate.

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Patent Owner(s)

  • MICRON TECHNOLOGY INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Thurgood, Blaine J Nampa, US 14 105

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